Arctic Cooling MX-2 – Thermal paste
High-Performance Thermal Compound! Keeping your CPU cool is crucial to your computer’s performance. This Arctic Cooling MX-2 features 30 grams of high thermal conductive and low thermal resistance compound and is ideal for use between CPUs, GPU cooling or other power semiconductor components and heat sinks where thermal conductivity is an issue! The MX-2 does not contain any metal particles, which ensure that contact to electrical circuits, pins and leads will not result in any damage. Plus, this thermal compound is durable (can last up to 8 years) and is safe to apply anywhere! Order this Arctic Cooling MX-2 30g Thermal Compound today!
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Cooler Master RR-910-HTX3-G1 130-Watt 92mm Hyper TX3 CPU Cooler for 775/1156/AMD/AM2/AM3
Cooler Masterâs Hyper TX series has evolved alongside with todayâs demanding mainstream CPUs. Cooler Master now releases a milestone productâthe Hyper TX3, Cooler Masterâs first-ever air cooler that is compatible with Intel LGA 1156 socket. The Hyper TX3 also re-release the original and effective direct contact heat-pipe design to ensure excellent heat dissipation.
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eXtreme-Cool 360(TM) Gaming Thermal Compound – EC-360 – 1 Gram
Easy to use, non-corrosive, and extreme performance make ec-360 an ideal thermal interface material for all gaming comsoles or gaming PCs. Specifically designed for the cooling needs of the Xbox 360 and other gaming machines. Low bleed, non-flowing and low evaporation. stable performance from -55~300°C. can withstand above 10,000 volts without causing a short! Lead Free and RoHS/SGS/MSDS certified
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TUNIQ TX-2 HIGH PERFORMANCE THERMAL COMPOUND
The TX-2 thermal compound offers industry leading thermal conductivity. The non-toxic and non-conductive nature of the TX-2 means more peace-of-mind when it comes to cooling your CPU. Molecularly small and structurally stable, the multi-award winning TX-2 is the perfect thermal compound for your cooling needs.
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Cooler Master ThermalFusion 400 High Performance Thermal Compound 4G RG-TF4-TGU1-GP
ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
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Antec Nano Diamond Thermal Compound Formula 7
Cooler Master IceFusion High Performance Thermal Compound 200G RG-ICFN-200G-B1
With enhanced thermally conductive non-curing compound, IceFusion provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.
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